Highest output, Highest ROI, Highest flexibility, Compact inline !!!

Unit-i4 is a new generation of selective wave soldering with the following features:
  • 2 drop jet fluxer.
  • Bottom IR preheating.
  • 2 solder pot in two individual wave tunnel, each pot with two wave tunnel.
  • PCB moving in by conveyor, conveyor table moving in X/Y, solder pot/fluxer moving in Z.
  • WINDOWS 10 system.
  • 3 axis full servo drive with ball screw movement.
  • Standard equipped with wave height calibration.
  • Real-time soldering process monitor.
Unit-i4 Specifications
    Item Unit-i4
    General
    Operating power/Max power 6KW/22KW
    Machine dimension 1300(L)*1840(W)*1200(H)
    Net weight 700KG
    Power supply 3PH 380V 50HZ
    Air supply 3-5 bars
    Exhausting required 800M3/h
    PC Yes
    Typical Program Time 10 Minutes
    Conveyor
    PCB dimension W50xL50---W508xL508mm(single nozzle soldering) W50xL50---W508xL250mm(two nozzle soldering parally) W50xL50---W250xL250mm(four nozzles soldering parally)
    PCB Clearance Top 95mm bottom 30mm
    PCB Weight Max 5kg
    Conveyor width Auto
    Conveyor assembling motion X,Y motion with server motor/driver
    PCB Robotic Platform
    Flux Nozzle Type Drop jet fluxer
    Flux Nozzle Quantity 2
    Flux Tank Capacity 1L
    Flux Tank Quantity 2
    Flux Nozzle Distance adjustable
    Preheat
    Preheating method Bottom IR heater
    Solder Management
    Solder pot type mechanical pump
    Standard Solder Stations 2
    Solder Pot Capacity 30 kgs
    Solder Temperature Control PID
    Heat-UpTime About 30mins
    Max Temperature 350 ℃
    Wave tunnel 4pcs (2pcs per solder pot)
    Mini Wave Nozzles Dia 3to12mm
    Customized nozzle Available
    Axes of Motion Z1, Z2
    (N2) Inertion Management
    N2 Consumption per Nozzle 6--8m3/H
    Required N2 Purity >99.99%